Rigid ENIG
Rigid Nickel ENIG
KG-535 (Medium-hight P 7~10%)
- The deposit obtained from KEN-535 is capable to keep P content in the same range through an operating period.
- Low lead(Pb) content control corresponding RoHS instruction is possible.
- The stable solder-ability during a operation period
- Long bath life and stability
Lead Concentration of KG-535's Deposits
Soft(Flexible) ENIG
Soft Nickel
KEN-531 (Medium P 5~8%)
- Excellent crack endurance
- Low lead content
- Stable solder-ability
- Long bath-life and stability
Grain Structure
After Bending Test
Crack Endurance
We suppose nickel structure has more effect to crack endurance than Phosphorus concentration.
According to the picture above, it’s obvious that KEN-531 has more ductility for its structure of nickel layer.
We attributes good crack endurance to the suppleness of nickel layer plated by KEN-531.
Flow chart of KG-series
ENEPIG
ENEPIG Process
WHY ENEPIG?
- Characteristic of Anti-Oxidation Barrier
→ Gives good Solder joint strength and Corrosion resistance
- Characteristic of Thermal Diffusion Barrier
→ Gives good Wire bonding strength
The thermal diffusion was observed in Ni/Au after 5 times reflow
Suitable for both of Bonding & Soldering
Palladium (KG-1100)
Gold (KG-2200)
Solder Joint Strength
IMC of Ni-Cu of ENIG is thicker than ENEPIG.
And ε（Ni,Cu)1Sn3 IMC which is the cause of poor soldering could not observe in ENEPIG.
Poor soldering by corrosion on Ni surface
Even after extended immersion time, the gold plating was incomplete. Consequently, It cannot be covered nickel completely by immersion gold plating
With electroless Pd plating, the surface of the electroless Ni-P plating was completely filmed within 30 seconds
ENIPIG
ENIPIG Process
Electroless Ni Immersion Pd Immersion Gold Process
Feature
- Compared with conventional ENEPIG process, Pd & Au film thicknesses are very thin.
- It has excellent solder ability and wire bond ability.
- The solution stability is excellent, because the Pd and Au solution Is replacement type.
- The cost performance is also excellent, because the Pd concentration of plating solution is 0.5g/L.
Film composition
Performance
Solderbility
W/B strength
