(주)KENSCO

Features and Benefits

- A type of sulfuric acid and hydrogen peroxide

- Suitable for Vertical & Horizontal (High Yield & Low Cost)

- Copper Concentration Resistance (0~50g/L)

- Hydrogen peroxide Decomposition Inhibition

After applying the horizontal line (‘S’ Company)
Parameters	Total Input	Stabilizer(1L vs.)	H2O2 (1L vs.)	Product (1m² vs.)
35% H2O2	1057L	23L	1L	0.11L
Stabilizer	46L	1L	0.044L	0.0047L
Production	9817m²	213m²	9.29m²	1m²

Features and Benefits

- Etching additive for Sulfuric acid/Hydrogen peroxide

- Available from dipping and spray process

- High etch rate can be measured in a short time and low temperature

- Can make thickness of copper evenly and thinly

- Surface of copper is bright after etching process

- Waste water treatment easy to control

- Inhibition of hydrogen peroxide decomposition is superior

Features and Benefits

- Excellent physical & chemical bonding strength

- Excellent Anti-tarnish effect and to increase adhesion

- Very low cost than competitive company (High Yield & Low Cost)

- Excellent bonding peel strength (Dry Film & PSR & ABF Film)