(주)KENSCO

Features and Benefits

- Suitable for Horizontal

- Excellent Bonding peel strength (High Tg & Low Dk & BT & Halogen Free Resin)

- Very low cost than competitive company (High Yield & Low Cost)

Process	A-type	B-type	C-type	D-type	E-type
Acid Cleaner	MC-100A
Alkali Cleaner	MC-9028P or MC-9030
Pre-dip	SB-200A or SB-210C
Brown oxide	SB-230A SB-210B SB-230AR (Replenisher)		HL-100R	HL-200R	HL-300M (Starter) HL-300R (Replenisher)
			H2SO4	H2SO4
			H2O2	H2O2

Features and Benefits

- Suitable for Vertical & Horizontal

- Excellent Bonding peel strength (High Tg & Low Dk & BT & Halogen Free Resin)

- Very low cost than competitive company (High Yield & Low Cost)

- Excellent Pink-Ring Resistance

PROCESS	KB Bond	HR Bond
	Alkali Reduction Type	Acid Reduction Type
Cleaner	MC-9030	MC-9030
Etching	HP	HP
Pre-dip	MO-201B	HR-300B
Black Oxide	MO-201A	HR-300A
	MO-201B	HR-300B
Reduction or Post dip	MR-301	HR-400A
	MO-201B	HR-400B

Features and Benefits

- Excellent physical Bonding strength (High Peel Strength)

- Excellent adhesion and high acid resistance(Anti Pink-Ring)

- Short Reaction time / Low Temperature Reaction

- Low Roll Mark for Horizontal process

- Suitable for High Tg & Low Dk (BT & Halogen Free Resin)

- Low Running Cost